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New XinLand High Power 100W 405 nm Fiber Coupled Laser High Stability UV-resistant Laser Diode

New XinLand High Power 100W 405 nm Fiber Coupled Laser High Stability UV-resistant Laser Diode

Regular price 55.959,42 €
Regular price Sale price 55.959,42 €
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SPECIFICATIONS

Accessory Type: Interface

Fiber Bend Radius: 120mm

Fiber Core Diameter: 105μm

Fiber Interface: SMA

Fiber Length: 3M

Laser Power: 100W

Laser Wavelength: 405nm±3nm

Operating Current: 20~21A

Operating Voltage: Dc 24V,24~26V

Product name: 405nm Fiber Coupled Laser

Size: 331*231*86mm

Wavelength: 405 nm

brand name: XinLand

condition: New

key selling points: Easy To Operate

place of origin: Shaanxi, China

spare parts type: Laser

warranty: 1 Year

weight (kg): 5

Specification
Parameters
Min
Typ
Max
Notes
Output Wavelength
402
405
408
nm
Laser Power

100
105
W
Operating Voltage

24
26
V
Operating Current

20
21
A
Slope Efficiencies
1.4
1.8
2.2
mW/mA
Electrostatic Discharge


500
V
Cooling Medium

Purified Water

H2o
Environment Temperature
18
22
25
Storage Temperature
-30
25
70
Water Temperature
18
19
22
Water Pressure

0.2
0.5
Mpa
Flow Velocity
20


Liter / min
Humidity

55%
70%
%RH
Fiber Bend Radius
-
120
-
mm
Fiber Axial Pulling Force
-
-
2
kgf
Fiber Core Diameter
-
105
-
μm
Numeric Aperture
0.2
0.22
0.24

Combined Beam Diameter
-
1.9
-
mm
Optical Fiber Length
-
3
-
m
Fiber Optical Interface
-
SMA
-

Products Description
1. High-end quality Fiber laser module provides 100W laser power through 105μm bundled fiber, dual fiber laser module. 2. Low power consumption and high reliability Fiber laser modules provide high brightness, small size, and ease of thermal management through distributed laser diodes.
3. Good performance and high stability Enables a water-cooled architecture with predictable high reliability, good performance, and uniform light spot. 4. Miniaturization and modularization 100W 405nm fiber module, small size/high power, core diameter 105μm, SMA interface dual fiber laser.
Application
10W 405nm fiber laser module is used in: UV exposure, UV light curing, UV printing, LDI exposure, laser plate making CTP, etc.
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